Bond180
Company

Last deal

Amount

Seed

Stage

20.07.2020

Date

3

all rounds

$24.2K

Total amount

General

About Company
Bond180 is a fintech that provides technology solutions for primary debt markets.

Industry

Sector :

Subsector :

founded date

27.06.2019

Number of employees

Company Type

For Profit

Last funding type

Seed

IPO status

Private

Description

The company offers a digital bond issuance platform that matches institutional investors with corporate borrowers, streamlining the origination process and reducing costs for both parties. This platform enables investors to source digital assets and raise funds in the debt capital markets. Additionally, Bond180 operates under the trading name "encloud," which is an IT services company that helps organizations save money on their cloud expenses in a secure manner.
Contacts

location

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