Company
Last deal
$13.9M
Local Amount - CNY 100.M
Amount
Series B
Stage
13.03.2024
Date
1
all rounds
$13.9M
Total amount
General
About Company
TICA New Materials is a developer of multi-layer co-extruded PVDC high-barrier heat shrink packaging films.
Also Known As
Tipack, 天加新材, 天加新材料集团股份有限公司, TICA New Materials Group Co., Ltd.
Number of employees
Company Type
For Profit
Last funding type
Series B
IPO status
Private
Contacts
Phone number
Website URL