With over 25 years of experience, AI Technology, Inc. has been at the forefront of developing and patenting applications for flexible epoxy technology in microelectronic packaging. They provide adhesive solutions for both military and commercial applications, specializing in component and substrate bonding. Additionally, their thermal interface material solutions, including patented phase-change thermal pads, thermal greases, and gels, have set benchmarks for performance and reliability in power semiconductors, modules, computers, and communication electronics.