Last deal

Amount

Series A

Stage

05.08.2024

Date

2

all rounds

$23M

Total amount

General

About Company
Thintronics helps electronics OEMs enhance their product innovation by using their dielectric platform for PCBs.

Industry

Sector :

Subsector :

founded date

01.01.2018

Number of employees

Last funding type

Series A

IPO status

Private

Description

Developer of a materials science platform designed to develop advanced materials for faster data transfer and lower energy consumption in electronics. The company's platform offers innovative thin-film materials that revolutionize data transmission speeds and energy efficiency in electronic devices, enabling clients to create next-generation products in fields such as artificial intelligence, data centers, and radio frequency systems.
Contacts