The company's main product is a high thermal conductivity ceramic packaging substrate created through a thin-film circuit manufacturing process. This involves using thin film metallization, image transfer, and TCV technology on a ceramic substrate with high thermal conductivity to form high-density double-sided wiring and vertical interconnection. Stacking technology is then used to create an integrated 3D structure tightly combined with the ceramic substrate. These packaging substrates are ideal for industries such as semiconductor lighting, power electronics, optoelectronics, and microwave radio frequency.